How to Fix CVE-2023-33063: Qualcomm, Inc. Snapdragon (Bundle Sibling)

By Sai Kiran Pandrala

CVE-2023-33063 ships in the same vendor advisory as CVE-2023-33106. The patched build at the primary write-up closes this CVE too.

What's different about CVE-2023-33063?

Memory corruption in DSP Services during a remote call from HLOS to DSP.

The flaw class and remediation are identical to the primary CVE in the bundle. A successful exploit can crash the process or, when chained, allow code execution by the remote attacker.

How to fix CVE-2023-33063

Apply the patched build documented in the primary write-up: How to Fix CVE-2023-33106. The vendor ships a single fix that covers every CVE in this advisory.

Frequently asked questions

Is CVE-2023-33063 actively exploited?

Yes. CVE-2023-33063 is on the CISA Known Exploited Vulnerabilities catalog, so federal civilian agencies are required to patch on the published deadline. Most enterprises treat the same date as the practical floor.

What is the CVSS severity of CVE-2023-33063?

High. See the advisory for the full CVSS vector.

Where can I read the official advisory?

See https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin

Does the patch require a reboot?

It depends on the deployment. Service-only updates usually need a service restart; OS-level fixes require a full reboot. Check the vendor release notes for the exact post-upgrade steps.

References

• Official vendor advisory: https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
• NVD: https://nvd.nist.gov/vuln/detail/CVE-2023-33063
• CISA KEV catalog: https://www.cisa.gov/known-exploited-vulnerabilities-catalog
• Primary write-up: How to Fix CVE-2023-33106

*This guide is part of the Qualcomm, Inc. Snapdragon bundle. Full remediation procedure is at CVE-2023-33106.*